PACK EXPO International takes place at McCormick Place in Chicago, IL October 14th - 17th. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.
Brandon Hetherington for | ManufacturingTomorrow
The content & opinions in this article are the author’s and do not necessarily represent the views of ManufacturingTomorrow
Featured Product
PI USA - Faster Electro-Optical Wafer Probing
High-density electro-optical PIC wafer probing enables parallel testing of photonic integrated circuits using arrays of mini piezo alignment engines operating simultaneously across a wafer. Each ultracompact aligner delivers nanometer-level positioning and fast, closed-loop optical coupling, enabling simultaneous electrical and optical probing at multiple points. This scalable approach increases throughput, shortens test cycles, reducing cost of test for high-volume PIC and EPIC manufacturing.










