Stahlin® Introduces Two Larger Sizes to SolarShield™ HMI Cover Line
Designed to provide top-tier protection for Human Machine Interface (HMI) screens, SolarShield HMI Covers are engineered to withstand challenging environments. Available in Opaque and Clear models, these durable, non-metallic covers protect equipment from UV rays, water, dust, and other environmental factors.
Siemens Xcelerator: Eplan and Siemens enable seamless data interoperability in machine engineering
Siemens and Eplan will make engineering and production processes for customers in machine and line building more efficient.
Reducing downtime and tackling workforce gaps: TeamViewer introduces Smart Service solution
By unifying software and hardware support in one solution, Smart Service enables manufacturers to minimize downtime, address workforce challenges, and streamline complex operations across IT and OT environments.
RS Enables Industrial Safety With Omron's NX Series Safety Controllers
Omron's NX Series safety controllers provide versatile, efficient solutions to common industrial challenges with a slate of integrated features designed to satisfy stringent safety requirements, prevent and mitigate risks, and improve operational efficiency.
Rootstock Software Unveils Winter '25 Release
Customer-driven updates expand ERP capabilities with Idea Factory, new operational efficiencies, and AI for manufacturers
Caracol and Additive Engineering Solutions (AES) Forge Strategic Partnership to Advance Aerospace & Defense Additive Manufacturing.
The collaboration will include AES installing a Heron AM platform to further expand their capabilities while focusing on leveraging AES's in-depth understanding of A&D requirements with Caracol's advanced technology to process critical projects like tooling for composites and full-scale engineering mockups.
Caracol and Additive Engineering Solutions (AES) Forge Strategic Partnership to Advance Aerospace & Defense Additive Manufacturing.
The collaboration will include AES installing a Heron AM platform to further expand their capabilities while focusing on leveraging AES's in-depth understanding of A&D requirements with Caracol's advanced technology to process critical projects like tooling for composites and full-scale engineering mockups.
MILAM 2025 Announced
The 9th annual Military Additive Manufacturing Summit & Technology Showcase (MIL AM) will take place on February 11-12, plus a Workshop Day February 13th, at the Tampa Convention Center in Tampa, FL.
AM Solutions advances automated post-processing with innovations and strategic partnerships
The exhibit was enriched by exciting insights into successful collaborations with industry leaders such as EOS and Stratasys, highlighting joint efforts that are shaping the future of additive manufacturing.
US Technology Investor Anzu Partners Signs Agreement to Acquire voxeljet AG to Accelerate Industrial-Scale 3D Printing Market
The closing of the transaction is expected to occur in March or April 2025. The purchase agreement is subject to customary closing conditions, including the approval of voxeljet's General Meeting and foreign investment clearance in Germany. The General Meeting of voxeljet is expected to take place in the first quarter of 2025.
MIT and Mecalux launch a groundbreaking project to accelerate logistics innovation
- The Intelligent Logistics Systems Lab will develop two key areas of research to boost warehouse robot productivity and optimize order distribution.
- Researchers will train self-learning AI models to learn from demand patterns and anticipate new customer buying habits.
GoEngineer Adds Formlabs Products to its Solutions Portfolio
GoEngineer, a recognized leader in providing best-in-class additive manufacturing and engineering solutions, has partnered with Formlabs, a leader in 3D printing, to deliver the latest commercial and dental solutions in desktop SLA and SLS 3D printing across the U.S. and Canada.
New 3D printing approach means better biomedical, energy, robotics devices
The liquid crystalline elastomer structures printed by Devin Roach of the OSU College of Engineering and collaborators can crawl, fold and snap directly after printing.
Aeva Expands Collaboration with SICK to Precision Sensing for Factory Automation Applications
Aeva's FMCW Technology to Power SICK's Portfolio of High-Performance Sensors for Manufacturing Automation Applications, with Initial Aeva Deliveries Expected Starting 1H 2025
Cincoze's Two Latest High-performance GPU Embedded Computers Create New Options for Edge AI Applications
With a compact size of only 260 x 200 x 85 mm and support for an NVIDIA MXM GPU card, they combine powerful computing performance and excellent graphics processing capabilities. It has been the best-selling model in the GPU Computing - GOLD product line for many years.
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