According to the latest report by PMMI Business Intelligence, there is a growing need for manufacturers to roll-out the Industrial Internet of Things (IIoT) across their enterprise. However, these companies should identify their existing "IIoT blind spots" before they do so.
With so many activities and over 2,600 scheduled demos taking place at PACK EXPO Connects, here is every preparation tool attendees need to ensure a successful event.
A pair of keynote speakers will address the "power of parity" and how to fast-track gender equality through investment strategies, as the PPWLN brings light to gender parity challenges and successes at PACK EXPO East
New blow-molding equipment and custom bottle designs boost sales by 24 percent in a year for Caribbean syrup and essence manufacturer.
Innovation Stage Q&A with SICK Inc. - To explore the impact of I4.0 and sensors in automated pharmaceutical manufacturing, we spoke with Ron Stuver, director of business consulting at SICK, Inc. (Booth LS-6419), a leading provider of manufacturing sensors.
Packaging Professionals Address Innovation Stage Topics set for PACK EXPO Las Vegas. By: Sean Riley, senior director, media and industry communications, PMMI, The Association for Packaging and Processing Technologies
Whether you're looking to maximize shelf impact, create a more e-commerce friendly package, increase sustainability, functionality or achieve other product differentiations, you'll find the packaging solutions you want at PACK Expo.
Our solution for the packaging industry eliminates the complicated operations traditionally associated with automation and enables you to integrate all systems and manage them using one single source. Visit us at Booth LS-6863.
Booth C-3238. This year Butler is showcasing our Ease of Use Enhancements on our core product - the SP1 Automatic Splicer.
PACK EXPO takes place in Las Vegas, NV September 23rd - 25th. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.
At booth #LS-5970, visitors will receive a personalized sample product tin with candy assembled through the cooperation between humans and machines - right in front of their eyes!
This year, the SICK booth will continue to display our Industry 4.0 prowess through live demonstrations of networked sensors and how data can be captured real time and displayed through a dashboard interface. Booth #LS-6419
After months paring down the many qualified entries, three days of onsite voting allowed PACK EXPO International and Healthcare Packaging EXPO attendees to be the ultimate judge of the most innovative new technologies at the show.
Bringing together 2,500 exhibitors and 50,000 attendees across 1.25 million net square feet of McCormick Place exhibit space, no event in the world this year is poised to offer targeted solutions to meet this increasing demand like PACK EXPO International and Healthcare Pack
Booth #E9238 - EWI UltraThinSeal will present sealing demos on an ultrasonic reciprocating-style VFFS bagmaker, making real packages from thin, complex flexible packaging films.
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry. WAI hosts trade expositions, technical conferences, and educational programs.