PACK EXPO 2019 - Butler Automatic
Booth C-3238. This year Butler is showcasing our Ease of Use Enhancements on our core product - the SP1 Automatic Splicer.
ManufacturingTomorrow - Special Tradeshow Coverage
PACK EXPO Las Vegas
PACK EXPO takes place in Las Vegas, NV September 23rd - 25th. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.
PACK EXPO 2019 - Omron
At booth #LS-5970, visitors will receive a personalized sample product tin with candy assembled through the cooperation between humans and machines - right in front of their eyes!
PACK EXPO 2019 - SICK Inc.
This year, the SICK booth will continue to display our Industry 4.0 prowess through live demonstrations of networked sensors and how data can be captured real time and displayed through a dashboard interface. Booth #LS-6419
PACK EXPO - Winners Crowned in Inaugural Technology Excellence Awards
After months paring down the many qualified entries, three days of onsite voting allowed PACK EXPO International and Healthcare Packaging EXPO attendees to be the ultimate judge of the most innovative new technologies at the show.
Major Industry Growth Forecast as Largest Ever PACK EXPO International Opens
Bringing together 2,500 exhibitors and 50,000 attendees across 1.25 million net square feet of McCormick Place exhibit space, no event in the world this year is poised to offer targeted solutions to meet this increasing demand like PACK EXPO International and Healthcare Pack
Talking PACK EXPO with EWI Ultra Thin Seal
Booth #E9238 - EWI UltraThinSeal will present sealing demos on an ultrasonic reciprocating-style VFFS bagmaker, making real packages from thin, complex flexible packaging films.
Sophisticated Automation Enhances Precision, Flexibility and Product Safety
Healthcare Packaging EXPO shines light on achieving greater agility, record keeping and speed in maintenance.
Talking PACK EXPO with Dorner
Booth #N4936 - Dorner will be showcasing 6 different demos with 13 unique conveyor platforms. Two of the demos showcase our new redesigned AquaGard 7350 Series which is scheduled to launch this October.
Talking PACK EXPO with OMRON
Booth #N4740 - One exciting example of flexible and interactive technology will be the new collaborative robots. The new line, brought by Omron and Techman, is safer, simpler to program and easier to integrate with other equipment
Talking PACK EXPO with QC Conveyors
Booth #S4314 - This year well be introducing our AS40 conveyors with backlights. These backlights are specially designed to fit within the frame of our conveyors and, when coupled with a translucent belt, provide extra contrast for vision systems to aid in inspection
Talking PACK EXPO with Emulate3D
Booth #E8902 - Emulate3D for Machine Builders brings together within a virtual environment the "two truths" of all automation systems - the mechanical truth (that's the CAD model), and the logical truth (that's the control system), before it becomes costly to modify either.
ManufacturingTomorrow - Special Tradeshow Coverage
PACK EXPO International
PACK EXPO International takes place at McCormick Place in Chicago, IL October 14th - 17th. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.
Talking PACK Expo with Phoenix Contact
Booth #E-8754 - EtherNet I/P network capable DC-UPS, "QUINT DC UPS", Unmanaged Ethernet Switches, "SFN Unmanaged Switches"
Talking PACK Expo with Banner Engineering
Booth #5115 - Durable Sensors for Washdown and Thermal Shock, Sensors for Challenging Targets and Innovations for the Data-Driven Factory
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The Wire Association International (WAI), Inc.
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry. WAI hosts trade expositions, technical conferences, and educational programs.
