After months paring down the many qualified entries, three days of onsite voting allowed PACK EXPO International and Healthcare Packaging EXPO attendees to be the ultimate judge of the most innovative new technologies at the show.
Bringing together 2,500 exhibitors and 50,000 attendees across 1.25 million net square feet of McCormick Place exhibit space, no event in the world this year is poised to offer targeted solutions to meet this increasing demand like PACK EXPO International and Healthcare Pack
Booth #E9238 - EWI UltraThinSeal will present sealing demos on an ultrasonic reciprocating-style VFFS bagmaker, making real packages from thin, complex flexible packaging films.
Healthcare Packaging EXPO shines light on achieving greater agility, record keeping and speed in maintenance.
Booth #N4936 - Dorner will be showcasing 6 different demos with 13 unique conveyor platforms. Two of the demos showcase our new redesigned AquaGard 7350 Series which is scheduled to launch this October.
Booth #N4740 - One exciting example of flexible and interactive technology will be the new collaborative robots. The new line, brought by Omron and Techman, is safer, simpler to program and easier to integrate with other equipment
Booth #S4314 - This year we'll be introducing our AS40 conveyors with backlights. These backlights are specially designed to fit within the frame of our conveyors and, when coupled with a translucent belt, provide extra contrast for vision systems to aid in inspection
Booth #E8902 - Emulate3D for Machine Builders brings together within a virtual environment the "two truths" of all automation systems - the mechanical truth (that's the CAD model), and the logical truth (that's the control system), before it becomes costly to modify either.
PACK EXPO International takes place at McCormick Place in Chicago, IL October 14th - 17th. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.
Booth #E-8754 - EtherNet I/P network capable DC-UPS, "QUINT DC UPS", Unmanaged Ethernet Switches, "SFN Unmanaged Switches"
Booth #5115 - Durable Sensors for Washdown and Thermal Shock, Sensors for Challenging Targets and Innovations for the Data-Driven Factory
Get a sneak peek at this year's PACK EXPO International and Healthcare Packaging EXPO show floor
To meet consumer demands for authentic and fresh-tasting foods, some innovative packaging technologies are doing the job normally given to preservatives, enabling manufacturers to keep the ingredient list to a minimum.
Visitors to our booth S-7527 will be able to try out the HTC Vive Virtual Reality (VR) headset to visualize typical end of line automated solutions. Any Emulate3D, Sim3D, or Demo3D model can be easily viewed in VR, which provides a genuinely immersive experience which puts you in the facility with the running equipment or system.
Visitors to the Beckhoff booth will again be able to "BYOD", using their own smartphones and tablets to connect with PC-based control demos - including a wall of IoT-enabled devices, plus articulated robot arms from Stäubli - using any mobile device with a web browser.
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The Russell AMPro Sieve Station™ guarantees the quality of your additive manufacturing (AM) powder, and has been designed to provide optimum sieving efficiency, ensuring your powder is ready for use or reuse as and when you require it. With a simple one-button operation and mobile design, this automated check screener ensures your powder at every stage of the process is qualified for use quickly and safely. The flexibility of the Russell AMPro Sieve Station™ means you can use the system for numerous powder handling tasks - being a modular design ensures the machine can be configured to meet your exact requirements.