Harvard John A. Paulson School of Engineering and Applied Sciences: Given the modular nature of their ink designs, many different filler and matrix combinations can be implemented to tailor electrical, optical, or thermal properties of the printed objects.
Sara Murphy for GreenBiz: 3D printing techniques, however, could be almost universally preferable, if industry steers in the right direction. And clear pathways exist for maximizing the technologys green potential.
Diogo Costa for KnowTechie: There are several aspects that characterize Industry 4.0, including (but not limited to): automated robots, additive manufacture, simulation, horizontal and vertical system integration, industrial IoT...
Dave Pinter for PSFK: The process works with the robot arm dispensing a stream of silicone into a tank of clear gel, the consistence of which isnt too far off from hair gel. The technique allows for object with internal volumes to be printed without extra internal support.
Rich Haridy for New Atlas: What previously took over an hour to print could now be created in just minutes thanks to a new 3D printer design from engineers at MIT
How Integrated Thermal Protection Technology Can Prevent Solid State Relay Failure in Industrial Systems
New thermal protection technology for large industrial/commercial HVAC and refrigeration systems, heavy duty transportation, conveyor belts, assembly lines, medical, energy and other complex manufacturing systems.
Terri Hiskey for MinuteHack: Glass may have finally found its home, and last month we heard news that industrial companies, such as General Motors, GE Aviation, Boeing and Volkswagen, have all been using the smart glasses to help workers perform complex manual tasks.
From Knowledge@Wharton: Manufacturing accounts for about 13% of the U.S. economy. Should we even focus on trying to "bring it back," now that information and services - the "knowledge economy" - seems a more promising path?
Apple Wins a Patent for a Future 3D Printing System that works with Augmented Reality and AR Glasses
Patently Apple: Apple notes that there's a need for further applications of a 3D printer, such as extending an existing real object through printing additional objects onto a surface of the existing object by using a 3D printer.
Michael Molitch-Hou for Engineering.com: Similar to digital light processing (DLP), layered slices are projected from the phone onto a vat of resin. The print bed is gradually lifted out of the vat with each flash of light until a complete object is revealed.
Zacks Equity Research: The HSS technology involves an infrared absorbing ink, that is selectively jetted onto layers of plastic powder, which are then exposed to infrared light. The powder melts under the light and forms functional plastic parts with qualities similar to those produced via Selective Laser Sintering, Multi Jet Fusion, or injection molding.
Nell Walker for Manufacturing Global: Using laser ultrasound rather than camera imaging, it is hoped that Duttons work could encourage the use of 3D printing within mass manufacturing industries, as it removes the need for a separate inspection process.
Kenny Walter for R&D Magazine: Researchers from Texas A&M University have strengthened 3D printed parts by applying traditional welding concepts to bond the submillimeter layers in a 3D printed part together.
Phys.org: Solar cells can generate electricity in an environmentally friendly way, but current, complex fabrication costs make the technology expensive.
Stuart Nathan for The Engineer: Like several concepts in mobile additive manufacture, the Spider bots grew out of a concept to build bases for exploration on the Moon and other planets.
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Powered by 10-core 10th-gen Intel® Xeon® or Core™ CPU, the DS-1300 is a rugged, high performance, highly expandable embedded computer. It supports up to two PCI/PCIe expansion slots (combined max 110 W), various commercially expansion cards available in image capture cards, motion control cards, or GPU cards. The DS-1300 series is suitable for deployment in industrial automation, factory automation, machine vision, AIoT and applications requiring high computing power in harsh environments.