HOLLOWAY AMERICA To Exhibit Industry-Leading Pressure Vessels at PACK EXPO
The stainless steel pressure vessel and tank fabrication company will share its engineering expertise and new innovations with visitors at the PACK processing and packaging exhibition in September.
Wind River's AXON Predict Analytics for VxWorks Enables IoT Analytics at the Edge
What do I want to eat yesterday? Seems like a strange question. Yet IoT systems are architected to often ask very similar questions by aggregating a massive amount of data in a central repository where every so often a data scientist can evaluate and perhaps realize some insights that would have been best realized and responded to at the time the events were taking place at the edge.
You Need to Implement the IIoT Before It's Too Late
Ease of access, improved productivity and automated decision-making are amongst the primary benefits of the IIoT. Those who hesitate are bound to suffer serious setbacks in output, customer service and overall competitiveness in the comings months and years.
UniStream® 5": PLC+HMI+I/Os Compact. Contemporary. Connected
Unitronics newly-released UniStream® 5" is a multi-function programmable logic controller in a superbly compact hardware profile: PLC+HMI+I/O built into a single unit.
CommScope Opens New Advanced Technology Centre in Belgium
CommScope and Yaskawa Invest in Manufacturing Innovation
Shuttleworth Introduces the Latest Innovation in Product Handling Solutions at Pack Expo 2017
Shuttleworth unveils a continuous motion dynamic accumulation conveyor system, delivering handling solutions for the most delicate products. (Shuttleworth Pack Expo Booth #C-3018)
VNew CODESYS-programmable RFID Interface Module from Turck Simplifies RFID Integration
The TBEN-L-RFIDs design makes this module ideal for retrofitting RFID applications. An IP67 rating allows its use outside the cabinet, and actuators and sensors can be connected with HF and UHF RFID read/write heads simultaneously.
Delta to Launch New IIoT-Enabling Platforms for Smart Machine Automation at Pack Expo 2017
Delta's new DIACloud, EtherCAT, and EtherNet/IP platforms allow machine builders to design leaner solutions and reduce overall costs
FANUC America Announces Winners of Advanced Automation Challenge 2.0
The challenge requires participating schools to design an automation project that relates to a real-world manufacturing application.
Benchmark to Showcase the Latest in Integrated Product Handling Automation Solutions at Pack Expo 2017
Benchmark features high-speed product loading systems for the food industry that increase productivity and reduce labor costs, and displays a form fill seal packaging solution for any application. (Benchmark Pack Expo Booth # C-3014)
Rennco Unveils a New High-Speed, Automated Bagging Solution at Pack Expo 2017
Renncos NextGen 301 operates at up to 60 BPM and delivers greater flexibility, faster changeover, and reduces labor and material consumption. (Rennco Pack Expo Booth # C-3229)
KLEENLine to Showcase Automated Case & Bag Loading System at Pack Expo 2017
KLEENLines innovative case/bagger loading solution offers product handling performance to increase production speeds and improve counting accuracy in a compact design, ideal for food and bakery applications. (KLEENLine Pack Expo Booth #C-3016)
ABB Pack Expo 2017 exhibit showcases leading edge product advancements that provide the flexibility to quickly adapt to evolving customer preferences
The Collaboration, Simplicity and Digitalization unique to ABB allow manufacturers to efficiently and safely handle multiple product and package variations
Microscan Debuts New Machine Vision Camera at The ASSEMBLY Show 2017
Microscan will run the first public demonstration of the new HAWK series machine vision camera at The ASSEMBLY Show in Rosemont, IL. The new development is poised to significantly exceed its predecessors in speed and power and will complete the Microscan's product line for machine vision.
Lean Execution System (LES)
Together, well-designed technology and people drive solutions. LES is a tool that empowers workers with real-time information to see and solve production problems and create innovation.
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Automation & IIoT - Featured Product
OnLogic's Helix 520 Series of Scalable Fanless Computers
The Helix 520 series utilizes the latest Intel Core Ultra processors with integrated edge AI capabilities to deliver exceptional performance and industrial-grade reliability for demanding applications in automation, robotics, machine vision, and more. Its unique modular design allows for flexible scaling of CPU and GPU performance, while robust connectivity and expansion options ensure seamless integration.
