Show Sponsors
Team One takes top prize at 2019 Amazing Packaging Race
The Association for Packaging and Processing Technologies, and sponsored by Emerson, the race brought together students from 14 Education Partner schools across the country to complete a series of challenges over 900,000 net-square-feet of exhibit space.
And the Winners are . . .
PMMI Presents the 2019 Technology Excellence Awards Winners
PMMI Announces Six PACK EXPO Scholarship Winners
"These scholarships display PMMI's continued investment in the next generation's industry leaders," says Jim Pittas, president and CEO, PMMI. "PMMI was honored to recognize these outstanding students' achievements in front of the industry during PACK gives BACK."
Schneider Electric shares new innovations providing packaging OEMs unprecedented ease in deploying IIoT-ready machines
- Modicon M262 controller is IIoT-ready for logic and motion applications
- TeSys Island offers new level of innovation in digital load management
- EcoStruxure Machine Expert streamlines intuitive machine programming
Massive PACK EXPO Las Vegas and Healthcare Packaging EXPO Mirrors Industry Growth
Based on the newly released State of the Industry US Packaging Machinery Report Infographic by show owner and producer PMMI, The Association for Packaging and Processing Technologies, packaging machinery shipments could reach $11.2 billion.
Epson Moverio Assist "See-What-I-See" Remote Assistance Solution Optimized for Epson Moverio Smart Glasses is Now Shipping
Leading Environmental Remediation Company Leveraging Moverio Assist for Increased Productivity and Remote Site Walk-Throughs
NORD Gear to Showcase Extended Line of Gear Units, Drive Systems and Mobile App at PACK EXPO 2019
NORD's intelligent drive solutions increase productivity, reduce costs for packaging, processing and material handling industries
Datalogic Brings New Technology Solutions for Manufacturers to PACK EXPO 2019
Hands on demonstrations and technology displays highlighting robotics and traceability at LS-6371.
One Voice Ready Certificate Program Closes Growing Skills Gap
PMMI's OpX Leadership Network's new certificate program transforms organizations and relationships between suppliers and end users
ID Technology Introduces TiltTouch™ Label Applicator Module
The TiltTouch is designed to print and apply labels to secondary packaging at high speeds.
Final Countdown to PACK EXPO Las Vegas and Healthcare Packaging EXPO 2019
Less than two weeks until the largest PACK EXPO Las Vegas and Healthcare Packaging
EXPO … EVER
Self-cleaning strainers for chocolate manufacturing
Liquid filtration system removes contamination from virgin and reclaimed chocolate
TOSIBOX Presents Automated Networking Solution to Combat IoT Connectivity Cybersecurity threats
Tosibox announces the North American availability of the TOSIBOX® Lock 500, a high-performance connectivity device that allows the industrial automation, building automation, and security sectors to safely manage and build IoT, remote and network management operations without the cybersecurity risks posed by traditional cloud- or IP address-operated technology.
Scheduled for display at the 2019 PACK EXPO in Las Vegas, Nevada, the TOSIBOX® Lock 500 along with TOSIBOX® Plug & Go™ technology is the first and only IoT connectivity solution that fully automates networking.
Rockwell Automation Helps Protect Food Safety and Pharmaceutical Quality with New Hygienic Hardware
PACK EXPO Las Vegas 2019 attendees can learn how to minimize contamination risks and ease compliance using the new technologies
Listen Up to UnPACKed with PMMI
Podcast presents new avenue for packaging and processing insights
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Featured Product
New stepper motor AM3248: exceptionally high speed and dynamics
The FAULHABER stepper motor AM3248 raises the bar in terms of performance and dimensions. Offering up to 10,000 rpm, it achieves five times the speed of comparable stepper motors. Combined with a gearhead reduction of 100:1, it supplies a torque of 5 Nm. With a diameter of just 32 mm, it is suited for a wide range of applications in areas such as aerospace, laboratory automation, the semiconductor industry, robotics and 3D printing. Learn more!
