Delta to Launch New IIoT-Enabling Platforms for Smart Machine Automation at Pack Expo 2017

Delta's new DIACloud, EtherCAT, and EtherNet/IP platforms allow machine builders to design leaner solutions and reduce overall costs

FANUC America Announces Winners of Advanced Automation Challenge 2.0

The challenge requires participating schools to design an automation project that relates to a real-world manufacturing application.

Benchmark to Showcase the Latest in Integrated Product Handling Automation Solutions at Pack Expo 2017

Benchmark features high-speed product loading systems for the food industry that increase productivity and reduce labor costs, and displays a form fill seal packaging solution for any application. (Benchmark Pack Expo Booth # C-3014)

Rennco Unveils a New High-Speed, Automated Bagging Solution at Pack Expo 2017

Renncos NextGen 301 operates at up to 60 BPM and delivers greater flexibility, faster changeover, and reduces labor and material consumption. (Rennco Pack Expo Booth # C-3229)

KLEENLine to Showcase Automated Case & Bag Loading System at Pack Expo 2017

KLEENLines innovative case/bagger loading solution offers product handling performance to increase production speeds and improve counting accuracy in a compact design, ideal for food and bakery applications. (KLEENLine Pack Expo Booth #C-3016)

ABB Pack Expo 2017 exhibit showcases leading edge product advancements that provide the flexibility to quickly adapt to evolving customer preferences

The Collaboration, Simplicity and Digitalization unique to ABB allow manufacturers to efficiently and safely handle multiple product and package variations

Microscan Debuts New Machine Vision Camera at The ASSEMBLY Show 2017

Microscan will run the first public demonstration of the new HAWK series machine vision camera at The ASSEMBLY Show in Rosemont, IL. The new development is poised to significantly exceed its predecessors in speed and power and will complete the Microscan's product line for machine vision.

Lean Execution System (LES)

Together, well-designed technology and people drive solutions. LES is a tool that empowers workers with real-time information to see and solve production problems and create innovation.

Helping companies improve supply chain management

Resource management software specialist Ardent Solutions is urging businesses to rethink their approach to supply chain management.

@ITT_Inc Enidine to Highlight Comprehensive Shock and Vibration Solutions at PACK EXPO Las Vegas

Designed for the most demanding packaging and automation applications, Enidines innovative, high-performing products offer market-leading reliability and extended service life. Engineering motion control solutions for more than 50 years, Enidine has a legacy and reputation for delivering products that are reliable, durable and efficient.

Eyelit's Integrated Manufacturing Execution System (MES) Implemented by Multi-Billion-Dollar Prestigious Power and Propulsion Systems Manufacturer

Eyelit software deployment fosters faster process improvements and NPI releases

Industrial Internet Consortium Launches Smart Factory Machine Learning Testbed

Plethora IIoT and Xilinx lead IIC testbed that accelerates machine learning for predictive maintenance in high-volume manufacturing

Laird Launches New Wireless 'Safe-E-Stop' for Emergency Shutdowns in Manufacturing, Automated Production Line Environments

Seconds matter when it comes to manufacturing and production line mishaps that can injure workers or damage equipment, especially in heavily automated environments. According to OSHA nearly 5,000 workers were fatally injured in industrial accidents in 2015.

TRUMPF's 'smart factory' is a factory and showroom in one

David Malone for Building Design & Construction: The smart factory is fitted with digitally networked machines that present the entire sheet metal process chain as an interlinked, holistic process.

METTLER TOLEDO to Exhibit at PACK EXPO Las Vegas

METTLER TOLEDO will showcase drum filling systems and industrial weighing solutions at the Continent's Premier Packaging Event PACK EXPO Las Vegas, September 25-27, 2017.

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Automation & IIoT - Featured Product

OnLogic’s Helix 520 Series of Scalable Fanless Computers

OnLogic's Helix 520 Series of Scalable Fanless Computers

The Helix 520 series utilizes the latest Intel Core Ultra processors with integrated edge AI capabilities to deliver exceptional performance and industrial-grade reliability for demanding applications in automation, robotics, machine vision, and more. Its unique modular design allows for flexible scaling of CPU and GPU performance, while robust connectivity and expansion options ensure seamless integration.