SYSPRO Partners with Versori to Unlock Smarter, Faster, AI-powered Enterprise Data Integrations for Manufacturers and Distributors
Partnership enables SYSPRO customers to reduce integration complexity, go to market faster, and unlock new revenue - while accelerating SYSPRO's shift to a cloud-first, AI-enabled future for digital manufacturing and distribution
HiveMQ Joins Inductive Automation Ecosystem to Power Real-Time Industrial Intelligence
Seamless edge-to-cloud backbone enables smarter operations and enterprise insights
RS Group's 2024/25 ESG report showcases significant progress
Representing the halfway point on the path to its 2030 ESG action plan, RS Group's 2024/25 ESG report reveals clear progress, along with a sharper focus on creating long-term value for all stakeholders.
Future in Motion: Ati Motors Product Day 2025 Marks a New Era in Industrial Automation Ati Motors debuts next-gen autonomous solutions, redefinin
Ati Motors hosted Product Day 2025 to unveil the SHERPA 10K and SHERPA MECHA, two next-generation autonomous robots designed to advance industrial automation. The event marked a milestone as the SHERPA AMR fleet approaches 1 million autonomous missions annually. Ati continues to lead in intelligent, high-performance robotics for global industries.
Revolutionizing Pharmaceutical Packaging: How Smith Drug Company Achieved 100% Uptime with PAC Strapping's SM60 Auto
Smith Drug Company transformed its pharmaceutical packaging operations by implementing PAC Strapping's SM60 Auto strapping machine, achieving 100% uptime and eliminating costly downtime caused by debris-related weld issues. The machine's innovative side weld design ensures cleanliness, reliability, and continuous operation, meeting the strict demands of pharmaceutical packaging while reducing maintenance and operational costs.
OnLogic and viso.ai Partner to Accelerate Scalable Deployment of Edge AI Computer Vision
The collaboration delivers optimized hardware and software solutions for scalable and reliable AI computer vision at the edge, unlocking transformative data intelligence for businesses of any size.
Are Smart Coatings the Next Frontier in Factory Maintenance?
Self-healing paint and anticorrosive coatings may be impressive, but they are not complete care solutions. They can only account for small damage and cover a limited range of operating concerns, so additional tools and technologies are still necessary.
PMMI Foundation Donates $100,000 to Michigan State University's School of Packaging
Gift supports student innovation and technical education at nation's first packaging school.
Industrial Encoder Corp. Introduces RH965 Redundant Incremental Hollow Shaft Encoder
Redundant incremental encoder featuring rugged construction, IP65-rated protection, and resolutions up to 2500 PPR-engineered for elevators, cranes and hoists, wind turbines, and other demanding environments.
Emerson Announces 2025 Discrete Automation Scholarship Recipients
Cornell Tech and Prairie View A&M University receive financial support for higher level STEM education and collegiate research
More than Half of Manufacturing Executives Maintain Optimism Amid Economic and Technological Shifts, According to Latest Sikich Report
Sikich Industry Pulse Survey Reveals 84% Expect AI to Become Standard Within Five Years
Rootstock Announces Summer '25 Release with AI-Powered ERP Agent & Expanded Financial Capabilities
Enhancements empower customers with a modern grid that improves user experience, support for a 13-period fiscal calendar, and contextual ERP automation
PACK EXPO Las Vegas Celebrates 30 Years of Innovation
A launch pad for packaging and processing breakthroughs, the biennial event has experienced significant expansion and influence.
Fictiv Transforms Injection Molding Services
Trusted global manufacturing and supply chain leader delivers best-in-class injection
molding experience with advanced DFM tools and unmatched mold build visibility
Pusan National University Researchers Reveal New Calibration Framework for Digital Twins
A new Bayesian calibration framework enhances prediction accuracy for digital twins in semiconductor material handling systems
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