MEETING THE SURGE IN ELECTRONICS MINIATURISATION WITH SCALABLE METAL FABRICATION SOLUTIONS

In an era defined by smarter, faster, and smaller electronic devices, precision and scalability in metal part manufacturing are no longer competitive advantages, they are prerequisites for innovation.

(1st September 2025, Muellheim, Germany) In an era defined by smarter, faster, and smaller electronic devices, precision and scalability in metal part manufacturing are no longer competitive advantages, they are prerequisites for innovation.


From consumer wearables and implantable medical devices to advanced sensor arrays and next-gen communication modules, electronics miniaturisation is now the beating heart of product development. But miniaturisation isn't simply a matter of shrinking designs, it demands new approaches to metal fabrication that traditional manufacturing methods often struggle to meet.
This is where photo-chemical etching (PCE), especially when delivered at scale and precision, changes the equation entirely.

Jochen Kern, Head of Sales and Marketing at the Micro Component Group says, "At the Micro Component Group, we bring together an unmatched capability to support electronics manufacturers from prototyping to high-volume production. Our Group combines reel-to-reel inline etching, batch etching, and electroforming to fabricate ultra-precise, stress-free metal components, including those with sub-25µm features, complex geometries, and ultra-thin profiles. And we do it at volume."

Photo-chemical etching offers clear, intrinsic advantages over traditional machining, stamping, or laser-cutting techniques. For electronics OEMs and designers, the benefits are transformative:
• Stress-free processing: PCE removes material chemically, which introduces no mechanical or thermal stress to delicate features.
• Design freedom: PCE supports complexity at no extra cost, multiple geometries, intricate cutouts, and mesh-like patterns can all be fabricated from a single sheet.
• Ultra-fine tolerances: Achieving tolerances as tight as ±10 µm, PCE enables repeatable accuracy even for the most miniaturised circuits and components.
• Scalable to any volume: From early prototyping with fast lead times to full-scale reel-to-reel production in the millions, PCE scales with your product lifecycle.
• Material versatility: Whether stainless steel, copper alloys, titanium, or even molybdenum, PCE processes them all cleanly and efficiently.

Kern continues, "For those unfamiliar with PCE, the key is choosing a supplier with both process depth and application insight. The Micro Component Group doesn't just manufacture parts, we work alongside your engineers, ensuring designs are optimised for etching from the outset. Our vertically integrated capabilities across Europe and North America mean you benefit from regional proximity, global scale, and world-class expertise."

"Whether you're advancing next-gen antennas, micro-connectors, battery contacts, or shielding components, PCE is the agile enabler you need, and the Micro Component Group is the partner to make it work."

www.micrometal.de

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