2016 Hackaday Prize Challenges Community of Designers, Engineers & Makers to 'Build Something That Matters'

Worldwide Competition Seeks Solutions to Address Tech Issues Facing Humanity

Inside 3D Printing 2016: A world full of business models

1,400 visitors at the leading specialist conference on additive manufacturing methods

Siemens - Intuitive operation and efficient engineering of process plants

• New version 8.2 of the Simatic PCS 7 process control system • Efficient, mobile plant monitoring • Intuitive plant management and efficient plant engineering • Runs under Microsoft Windows 10 and Microsoft Server 2012

ADLINK Launches New Open Modular Architecture for Industrial Cloud Computing

Modular Industrial Cloud Architecture (MICA) is the next generation of cloud computing technology, optimizing performance, cost and space for COTS platforms

IronCAD Announces COMPOSE Mobile 2016

IronCAD COMPOSE Mobile - Communicate-Collaborate-Configure-Anywhere

SofTech Announces Partnership with T-Systems

SofTech, Inc. (OTCQB: SOFT), a leading provider of enterprise technology solutions and consultancy services today announced its partnership with T-Systems International GmbH, creator of PDM WebConnector, a web-based system integration solution. A division of Deutsche Telekom, T-Systems operates information and communication technology (ICT) systems for multinational corporations and public sector institutions.

JMP Engineering Achieves Highest Partner Status with Rockwell Automation

OSI Laser Diode Introduces Triple-Wavelength TCW RGB TriBiner Visible Laser

OSI Laser Diode, Inc. (LDI), an OSI Systems Company, announces the innovative TCW TriBiner fiber-coupled laser, the TCW RGBM-105R. The new triple wavelength device is a red, green, and blue (RGB) laser diode module that has been specifically designed to meet strict efficiency footprint requirements of the visible laser display market.

Stratasys Chief Business Officer, Joshua Claman, to Discuss 3D Printing and the Supply Chain at The Economist Events' Innovation Forum Today in Chicago

The Economist Events Innovation Forum Features Leading Innovators from the Public and Private Sector

DuPont Performance Materials to showcase lightweighting and air management solutions for vehicles at VDI Congress

Latest developments in computer aided engineering also in focus at Plastics in Automotive Engineering Congress

IMTS 2016 ADDITIVE MANUFACTURING PAVILION SHOWCASES TECHNOLOGIES, PRODUCTS READY FOR PRIME TIME

A novelty at IMTS 2008, 3D printing is taking its rightful place as an industrial solution.

LASYS becomes more global: International cooperation agreed

LASYS Specialist Press Conference at Audi: Experts provide outlook for 5th LASYS in Stuttgart

Cybersecurity Ranks As #1 Hottest Technology In The Computer Industry According To IEEE Computer Society

Not unexpectedly, cybersecurity ranked number one among all industry segments and among both professionals with less than 10 years' experience and those with greater than 10 years. Fully, 56-58% of respondents said that this technology has the greatest impact on their industry.

ODU Extends Its Portfolio of Advanced Monitoring Connector Solutions for Vision Systems

ODUs product series respond to an increased market demand for embedded vision, an increased use in robotics and a rising demand for non-industrial applications.

Siemens to Host Annual Manufacturing in America Conference at Ford Field

Siemens and Electro-Matic Products, Inc. will host the Manufacturing in America conference at Ford Field March 23-24 in Detroit. The two day event will bring together manufacturing and automotive industry executives, technology leaders, educators and students to explore technologies and best practices driving manufacturing in America.

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