METTLER TOLEDO to Exhibit at PACK EXPO Las Vegas
METTLER TOLEDO will showcase drum filling systems and industrial weighing solutions at the Continent's Premier Packaging Event PACK EXPO Las Vegas, September 25-27, 2017.
Type A Machines, BriteLab, and Circuit Launch Announce Relationship to Enable Scalable Microfabrication Based on Print Pod, Type A Machines' Digital Fabrication Platform
New relationship enables hardware startups, as well as established brands to seamlessly scale 3D manufactured products in both capacity and complexity.
Programmable Electric Actuators Rapidly Replacing LVDT's, Ball Screws in Pin Insertion and Height Gauging
Programmable electric actuators have been increasingly favored as airless substitutes for LVDT's and ball screws in connector pin insertion and connector pin height measurement. Unlike ball screws or LVDT's, electric actuators have programmable positioning. They can press the pin in with the correct force, verify its position, and provide a tight fit every time.
B&W MEGTEC Introduces the GigaCoater™ for Lithium-Ion Battery Electrodes
New wide-web coating system uses simultaneous 2-sided process to produce up to 3 GWhr of battery electrode output annually, creating enough capacity for 30,000 electric vehicles configured for 100 kWh or 5 hours of backup power for 300,000 homes based on average consumption of 2 kWh.
SME's Canadian Manufacturing Technology Show Celebrates 150 Years of Canadian Innovation, Expansion and Opportunity
Manufacturing has long been a critical component of the Canadian economy - even before formation of the Dominion in 1867.
Startups to Display Breakthroughs in Smart Cities and IoT at CES Unveiled Amsterdam
Press and industry executives from 23 countries registered for the event
PTC to Exhibit at IoT Solutions World Congress 2017
Industrial IoT Solution Demo Will Be Featured in Testbed Area; PTC Executive to Speak on Dynamic Digital Supply Network Panel
Allied Motion Expands Line of Frameless MegafluxTM Direct Drive Torque Motors
Smaller sizes added to accommodate wider range of OEM applications
ST Robotics Develops the Workspace Sentry to meet world's first specification of safety requirements for collaborative robot applications
ISO/TS 15066 ST Robotics Workspace Sentry Robot is based on small module which sends infrared beams. Unit's module comes with three beams at different angles. Product meets the International Organization for Standardization/Technical Specification 15066 on collaborative operation.
UnionTech™ RSPro 600: 3D Printing Technology Forged in The Crucible of Competition
The UnionTech RSPro 600 printed parts demonstrate excellent sidewall quality and fine detail, contributing to lower post-finishing requirements. Key Features of the RSPro 600 include: large build platform, 600 mm x 600mm x 500 mm enables multiple small part production as well as large parts and layer thicknesses as low as 0.05 mm (0.002 in) layer thickness for excellent surface quality with scanning speeds up to 12 m/s.
Electronic Assembly Technology Improves Packaging
On September 25, 2017, at 1pm PST, SMAC Moving Coil Actuators President, Edward Neff, and SMAC Moving Coil Actuators Sales Manager, Steve Curtiss, will return to Pack Expo Las Vegas to speak at the session, Applying "Zero Defect" Electronic Assembly Actuators to the Packaging Industry. During this session, Mr. Neff and Mr. Curtiss will explain how mechatronic advancements in Electronic Assembly can be applied to the Packaging Industry to maximize quality, uptime, and profits.
Peco InspX Announces Presence At 2017 Pack Expo In Las Vegas, Nevada
Peco InspX Will Feature a Special Exhibit on Plastic Detection with X-Ray Systems
Matrix Introduces at Pack Expo Two New Morpheus Models for High-Throughput F/F/S Applications
For frozen, fresh-cut, and IQF packaging, a single new Morpheus XL featuring extra wide jaws can do the work of two older and less capable f/f/s machines. For companies standardized on Rockwell Automation, Matrix developed a new Morpheus offering state-of-the-art Rockwell Automation controls, drives, I/O, and industrial computer. (Matrix Pack Expo Booth # C-3425)
Innovation Stage Presentation by Mitsubishi Showcases Packaging Solution to Double Shelf Life
Free Educational Program Held at PACK EXPO Las Vegas (Sept. 25 - 27)
Dow to Showcase How Material Advances Can Improve Battery Design and Assembly at The Battery Show
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