AOI and SPI Data Fusion: The Key to Defect-Free SMT Production
Discover how AOI and SPI data fusion transforms SMT production. By integrating SMT AOI Inspection with SPI, manufacturers achieve 97% yields, 60% less rework, and predictive maintenance, ensuring high-quality PCBs with minimal defects.
Walking through an SMT factory, you can feel the hum of precision. But even the best lines face defects—until AOI and SPI data fusion steps in. As a reporter covering electronics manufacturing, I've seen how this approach redefines quality control.
Take a recent case at an automotive PCB supplier. They struggled with solder joint failures, costing them 15% in rework. By fusing SMT AOI Inspection with SPI, they mapped defects from paste application to final assembly. SPI flagged volume inconsistencies (100-150 μm³ range), while AOI caught post-reflow misplacements with ±0.2 mm accuracy. The result? Defects dropped by 25%, and first-pass yield hit 97%.
I.C.T's advanced SMT solutions made this possible. Their systems synchronized data in real-time, letting engineers pinpoint issues like stencil misalignments instantly. One operator shared, "The alerts catch problems before they spread—it's like having an extra set of eyes." Predictive maintenance, driven by AI, also cut downtime by 30%, saving thousands.
For SMT professionals, this means less scrap, fewer false positives (down to 2.3%), and smarter processes. I.C.T's global service ensures seamless integration, making data fusion accessible. Curious? Contact smt@smt11.com to explore how this can elevate your PCB assembly.
#SMT #PCBA #SmartManufacturing
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