SEMI Inspection and Metrology Solutions at SEMICON West 2025
Visit TRI's Booth No. 5581 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
[August 18, 2025 - San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON West held at Phoenix Convention Center, Phoenix, Arizona from October 7 - 9, 2025.
Visit TRI's Booth No. 5581 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
Wafe AVI TSV Metrology SWIR+AI. Inner Crack. Chiplet Metrology Wire/Die Bonding
TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.
TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the 3D SEMI AOI TR7700Q SII-S with AI-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.
Visit TRI's Booth No. 5581 at SEMICON West 2025 to explore TRI's SEMI solutions.
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About Test Research, Inc. (TRI)
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.
Featured Product
Model TR1 Tru-Trac
The Model TR1 Tru-Trac® linear measurement solution is a versatile option for tracking velocity, position, or distance over a wide variety of surfaces. An integrated encoder, measuring wheel, and spring-loaded torsion arm in one, compact unit, the Model TR1 is easy to install. The spring-loaded torsion arm offers adjustable torsion load, allowing the Model TR1 to be mounted in almost any orientation - even upside-down. The threaded shaft on the pivot axis is field reversible, providing mounting access from either side. With operating speeds up to 3000 feet per minute, a wide variety of configuration options - including multiple wheel material options - and a housing made from a durable, conductive composite material that minimizes static buildup, the Model TR1 Tru-Trac® is the ideal solution for countless applications.
