All Manufacturing and Automation News Headlines

Electrons, not Ions, Provide Superior Plasma Etching of Nanoscale Semiconductor Devices

02/27/20, 08:36 AM | Additive & 3D Printing, Engineering

Accelerated waves of electrons, not ions, gently lift away atoms for superior etching and atomically smooth surfaces

Introspect Technology Adds MIPI C-PHY and D-PHY Frame Grabber Solutions for CSI-2 Image Sensors

02/27/20, 05:59 AM | Automation & IIoT, Supply Chain

Based on the company's E Series modules, the SV4E-CPRXG and SV4E-DPRXG are necessary for validating vision and imaging systems based on MIPI CSI-2 video links

Fastec Imaging Releases the HS7 Full HD High-Speed Camera System

02/27/20, 05:57 AM | Automation & IIoT, Supply Chain

Fastec Imaging is pleased to announce the release of the HS7, a full HD high-speed camera with unique high-speed image transfer capabilities.

Siemens Mobility Further Invests in Stratasys 3D Printing Solution to Support 30-Year Digital Rail Maintenance Project

02/27/20, 05:44 AM | Additive & 3D Printing, Engineering | Stratasys

Two Stratasys Fortus 450mc 3D Printers mark the start of Siemens Mobility's 'Easy Sparovation Part®' expansion to Russia, enabling rapid spare part production for 16 high-speed trains in operation, with 13 more to be delivered

Ultimaker Cura prepares 2.000.000 print jobs per week

02/27/20, 05:41 AM | Additive & 3D Printing, Engineering | Ultimaker

Ultimaker marks milestone with online Marketplace and new features in Ultimaker Cura 4.5

Datakit: A new library for FBX format

02/27/20, 05:13 AM | Automation & IIoT, Engineering | Datakit

The French data transfer specialist in CAD systems adds a writer for FBX format files to their current offer. It's a fast and compact format used mainly in the animation world and is read natively on Windows 10.

PALLET ALLIANCE TO EXHIBIT AT MODEX 2020

02/26/20, 11:24 AM | Supply Chain, Engineering

Experts from Pallet Alliance will be onsite to promote the company's IntelliPalletTM technology, the industry's first IoT-enabled wooden pallet system for greater supply chain & logistics visibility

QEI's Industry leading MicroPAQ Communication, Monitoring & Control Module

02/26/20, 07:30 AM | Automation & IIoT, Supply Chain | QEI, LLC

QEI's Industry leading MicroPAQ Communication, Monitoring & Control Module

Additive Flow - Accelerating AM Innovation with Innovative Digital Technologies

02/26/20, 06:01 AM | Additive & 3D Printing, Engineering

Additive Flow formally introduces its multi-functional optimisation software with simultaneous, multi-property capabilities.

ALIO INTRODUCES ASYMMETRIC XY STAGES WITH NANOMETER-LEVEL PRECISION

02/26/20, 05:21 AM | Supply Chain, Engineering

NORD Gear to Demonstrate its Intelligent Drive Solutions for Intralogistics at MODEX 2020

02/25/20, 12:33 PM | Automation & IIoT, Supply Chain | NORD DRIVESYSTEMS

Supply chain efficiencies are powered by NORD's high-performance drive systems

FLIR Introduces Next Generation of Compact, High-Definition Thermal Science Cameras

02/25/20, 12:28 PM | Supply Chain, Engineering

FLIR Systems, Inc. (NASDAQ: FLIR) today announced the FLIR A8580 series of thermal science cameras: a 1.3 megapixel, entry-level cooled camera designed for a wide range of industrial, military, science, and product research and development (R&D) applications.

OnLogic Mini PCs Powered by AMD Processors Now Shipping, EPYC Powered Edge Servers Coming Soon

02/25/20, 08:46 AM | Automation & IIoT, Engineering

OnLogic is now shipping mini computers powered by AMD Ryzen™ Embedded Processors. Edge Servers powered by AMD EPYC™ Processors are expected in Q2.

VELO3D Announces Partnership with Duncan Machine Products for 3D Printing of Oil & Gas Industrial Parts

02/25/20, 06:40 AM | Additive & 3D Printing, Engineering

SupportFree metal additive manufacturing with Sapphire system will lower costs, improve quality, and cut delivery times

When Moore's Law is no Moore

02/25/20, 06:40 AM | Engineering

For half a century, the technology industry has been built on a set of rules that have defined how everything from power electronics to computer chips are designed. Among these rules is Moore's Law, which has been underpinning innovation since 1965, but it is expected to come to an end in the coming years. This is creating an urgent need for innovation in computing, design and materials, as Ben Smye, head of growth at materials search engine Matmatch, explains.

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