Teledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025
New Hardware and Software Development Kit Accelerates Thermal Imaging and AI Integration at the Edge
Goleta, California. - Sept. 2, 2025 - Teledyne FLIR OEM, part of Teledyne Technologies Incorporated (NYSE: TDY) and the global leader in thermal imaging innovation, today announced the launch of the Boson®+ IQ Development Kit. The comprehensive solution combines reference hardware with Prism™ software, empowering integrators to rapidly develop edge AI capabilities using advanced thermal sensing across defense, security, and industrial platforms.
At the heart of the kit is the Teledyne FLIR OEM AVP, powered by the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC), which delivers an industry-leading 50 trillion operations per second (TOPS) with a typical power draw of just 2.5 watts. Its multicore architecture supports Prism AI object detection models and Prism ISP features, including denoising and super resolution to provide exceptional image clarity in challenging environments.
"The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics," said Jared Faraudo, vice president of product management and programs, Teledyne FLIR OEM. "By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we're enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption."
Designed for flexibility and scalability, the kit includes interface and carrier boards with three MIPI interfaces, allowing developers to integrate visible or other sensor types into their systems. It also comes with the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and expert engineering support, providing a seamless development experience from prototype to deployment.
The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions, including Prism SKR and Prism Supervisor. Prism SKR facilitates autonomous target detection and terminal guidance, while Prism Supervisor offers autonomous operation to designated way points via GPS or visual-based navigation (VBN) location technology. These software-enabled features can add powerful capabilities to mission-critical applications in defense, security, and industrial automation.
Experience the Boson+ IQ Development Kit in action at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London, Sept. 9-12, one of the world's premier defense and security exhibitions. For more information, visit https://oem.flir.com/boson-plus-iq/.
###
About Teledyne FLIR OEM
Teledyne FLIR OEM, a Teledyne Technologies company, is the world's largest volume manufacturer of ITAR-free and NDAA-compliant infrared (IR) sensor and camera modules. As a vertically integrated supplier, Teledyne FLIR OEM delivers thousands of thermal imaging modules and related software tools daily for defense, automotive, uncrewed, professional, and artificial intelligence applications designed to improve decision support and situational awareness. Teledyne FLIR OEM enables life-changing thermal sensing so the world can do and see more. For more information, please visit https://oem.flir.com/ or follow @flir.
Featured Product

OnLogic's Helix 520 Series of Scalable Fanless Computers
The Helix 520 series utilizes the latest Intel Core Ultra processors with integrated edge AI capabilities to deliver exceptional performance and industrial-grade reliability for demanding applications in automation, robotics, machine vision, and more. Its unique modular design allows for flexible scaling of CPU and GPU performance, while robust connectivity and expansion options ensure seamless integration.