From Hanchen Huang of Northeastern University:
MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.
Emulate3D software helps you model and test your AMHS solutions rapidly. Use Demo3D to create running models quickly, then generate videos, stills, or view the models in virtual reality at the click of a button. Sim3D enables you to carry out experimental test runs to select optimal solutions and the most robust operating strategy, and Emulate3D Controls Testing is the best way to debug your PLCs offline, and off the project's critical path. Connect to major PLCs, import CAD, and plug into HTC Vive and Oculus Rift to produce awesome models!