From Hanchen Huang of Northeastern University:
MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.
Robotmaster V6 provides a unique integration of user control, speed and flexibility to Robotmaster's renowned automation and optimization tools. The new and intuitive V6 interface elevates Robotmaster to an unprecedented standard of user experience by giving robot programmers a coherent and dynamic tool that radically saves time and money.