MesoGlue: Room Temperature Metallic Glue

From Hanchen Huang of Northeastern University: MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection. Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated. MesoGlue Silver: A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure. MesoGlue Eutectic: A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure. (MesoGlue Homepage)

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MarkLogic - How to Win the New Industrial Revolution

MarkLogic - How to Win the New Industrial Revolution

Use Data to Deliver Efficiency, Reduce Risk, and Create Better Products. Disruptive technologies and market changes are transforming the manufacturing industry, requiring a new focus on optimizing use of data and information. It all adds up to a new industrial revolution called Industry 4.0. Organizations who want to realize the potential of this revolution need to "Industrialize their data," making it a core asset to deliver better products and customer service, navigate complex business environments, and transform for the future. MarkLogic customers are delivering on this vision for data with a proven architectural pattern called the Operational Data Hub that simplifies the integration of data along the digital thread to power operational and analytic use cases across the enterprise.