From Hanchen Huang of Northeastern University:
MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.
With two product lines, FASTSUITE for V5, which is seamlessly integrated with CATIA/DELMIA V5, and FASTSUITE Edition 2, a standalone platform, the areas of OLP (offline programming), manufacturing simulation and virtual commissioning are the core of our business activities. Our applications and solutions are not only focused on real customer needs, but they are also designed to improve efficiency and quality of our customers' manufacturing processes. No matter if the process is just about offline programming of a single robot at a small job-shop company or about the validation of a complete production line at an Automotive or Aerospace OEM. We strive to ensure a constant quality of our services and to provide the best possible support to our worldwide customers. Therefore we have established three digital manufacturing hubs around the world. All our teams have a proven expertise on manufacturing process integration and profound IT implementation skills.