From Hanchen Huang of Northeastern University:
MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.
Use Data to Deliver Efficiency, Reduce Risk, and Create Better Products.
Disruptive technologies and market changes are transforming the manufacturing industry, requiring a new focus on optimizing use of data and information. It all adds up to a new industrial revolution called Industry 4.0.
Organizations who want to realize the potential of this revolution need to "Industrialize their data," making it a core asset to deliver better products and customer service, navigate complex business environments, and transform for the future. MarkLogic customers are delivering on this vision for data with a proven architectural pattern called the Operational Data Hub that simplifies the integration of data along the digital thread to power operational and analytic use cases across the enterprise.