From Hanchen Huang of Northeastern University:

MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.

Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.

MesoGlue Silver:
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.

MesoGlue Eutectic:
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.

(MesoGlue Homepage)