SME's Canadian Manufacturing Technology Show Celebrates 150 Years of Canadian Innovation, Expansion and Opportunity
Manufacturing has long been a critical component of the Canadian economy - even before formation of the Dominion in 1867.
Startups to Display Breakthroughs in Smart Cities and IoT at CES Unveiled Amsterdam
Press and industry executives from 23 countries registered for the event
PTC to Exhibit at IoT Solutions World Congress 2017
Industrial IoT Solution Demo Will Be Featured in Testbed Area; PTC Executive to Speak on Dynamic Digital Supply Network Panel
Allied Motion Expands Line of Frameless MegafluxTM Direct Drive Torque Motors
Smaller sizes added to accommodate wider range of OEM applications
ST Robotics Develops the Workspace Sentry to meet world's first specification of safety requirements for collaborative robot applications
ISO/TS 15066 ST Robotics Workspace Sentry Robot is based on small module which sends infrared beams. Unit's module comes with three beams at different angles. Product meets the International Organization for Standardization/Technical Specification 15066 on collaborative operation.
UnionTechâ„¢ RSPro 600: 3D Printing Technology Forged in The Crucible of Competition
The UnionTech RSPro 600 printed parts demonstrate excellent sidewall quality and fine detail, contributing to lower post-finishing requirements. Key Features of the RSPro 600 include: large build platform, 600 mm x 600mm x 500 mm enables multiple small part production as well as large parts and layer thicknesses as low as 0.05 mm (0.002 in) layer thickness for excellent surface quality with scanning speeds up to 12 m/s.
Electronic Assembly Technology Improves Packaging
On September 25, 2017, at 1pm PST, SMAC Moving Coil Actuators President, Edward Neff, and SMAC Moving Coil Actuators Sales Manager, Steve Curtiss, will return to Pack Expo Las Vegas to speak at the session, Applying "Zero Defect" Electronic Assembly Actuators to the Packaging Industry. During this session, Mr. Neff and Mr. Curtiss will explain how mechatronic advancements in Electronic Assembly can be applied to the Packaging Industry to maximize quality, uptime, and profits.
Peco InspX Announces Presence At 2017 Pack Expo In Las Vegas, Nevada
Peco InspX Will Feature a Special Exhibit on Plastic Detection with X-Ray Systems
Matrix Introduces at Pack Expo Two New Morpheus Models for High-Throughput F/F/S Applications
For frozen, fresh-cut, and IQF packaging, a single new Morpheus XL featuring extra wide jaws can do the work of two older and less capable f/f/s machines. For companies standardized on Rockwell Automation, Matrix developed a new Morpheus offering state-of-the-art Rockwell Automation controls, drives, I/O, and industrial computer. (Matrix Pack Expo Booth # C-3425)
Innovation Stage Presentation by Mitsubishi Showcases Packaging Solution to Double Shelf Life
Free Educational Program Held at PACK EXPO Las Vegas (Sept. 25 - 27)
Dow to Showcase How Material Advances Can Improve Battery Design and Assembly at The Battery Show
Enclosed Power Supplies for Automation from Balluff
The hardware for the enclosed power supplies is designed for inclusion in a self-contained piece of automation equipment.
Jam-Packed Weekend of Fun Planned for Balboa Park's Maker Faire: Featuring Local, Regional and International Makers
Maker Faire San Diego takes over Balboa Park October 7-8, 2017. Artists, creators, engineers and do-it-yourselfers of all kinds will fill the venues of the Park, inside and out including nine participating venues, robots, drone battles, soldering, food trucks, competitions, crafting, and lasers and thats only the start.
Butler Automatic Announces Expanded Sales Team to Service the Packaging Industry
Team includes industry veterans focused on global sales and application support
Retrofitting industrial machines with IoT board to measure their performance
This new modular solution, conceived and developed by the Italian digital innovation and design shop Cefriel, is designed to work both with older, non-natively connected machinery, and with newer models that are equipped with Internet connections.
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Featured Product
FLIR Si1-LD - Industrial Acoustic Imaging Camera for Compressed Air Leak Detection
The FLIR Si1-LD is an easy-to-use acoustic imaging camera for locating and quantifying pressurized leaks in compressed air systems. This lightweight, one-handed camera is designed to help maintenance, manufacturing, and engineering professionals identify air leaks faster than with traditional methods. Built with a carefully constructed array of MEMS microphones for high sensitivity, the Si1-LD produces a precise acoustic image that visually displays ultrasonic information, even in loud, industrial environments. The acoustic image is overlaid in real time on a digital image, allowing you to accurately pinpoint the source of the sound, with onboard analytics which quantify the losses being incurred. The Si1-LD features a plugin that enables you to import acoustic images to FLIR Thermal Studio suite for offline editing, analysis, and advanced report creation. Field analysis and reporting can also be done using the FLIR Acoustic Camera Viewer cloud service. Transferring of images can be managed via memory stick or USB data cable. Through a regular maintenance routine, the FLIR Si1-LD can help facilities reduce their environmental impact and save money on utility bills.
