SECS/GEM on Applied Materials Centura TAO Ta2O5 CVD Through the EIGEMBox
In the semiconductor manufacturing industry, communication protocols and automation are the backbone of efficient operations. One of the most prominent protocols is SECS/GEM (SEMI Equipment Communications Standard/Generic Equipment Model), which ensures seamless communication between factory host systems and equipment. When it comes to advanced tools like the Applied Materials Centura TAO Ta2O5 CVD system, leveraging SECS/GEM via the EIGEMBox is a game-changer for precision, efficiency, and scalability.
This blog explores the implementation of SECS/GEM on the Applied Materials Centura system, the role of the EIGEMBox, and how these technologies together drive automation in semiconductor fabs.
AI-powered Solutions for Sensing and Tracking
Datalogic, a global technology leader in automatic data capture and industrial automation, and Datasensing, a company specialized in sensors, safety, and machine vision, are proud to announce their participation in Automate 2025, North America's premier industrial automation exhibition.
NORD DRIVESYSTEMS Announces Updates to Helical Worm Gear Units to Offer Wider Power Range
NORD's time-tested, reliable worm gear drives have been engineered to provide more torque within the same compact footprint.
Comau enters into a binding agreement to acquire Automha
-Comau announced today that it has entered into a binding agreement with Trasma S.r.l. ("Trasma") under which Comau will acquire full ownership of Automha S.p.A. ("Automha") and its subsidiaries globally
-The strategic investment by Comau is a further step in building a forward-focused Italian automation Hub and will leverage the strong synergies between the two brands to create value for customers and shareholders in different markets around the world
-Automha will continue to operate post-acquisition with the same structure, management and strategic vision in addition to enhanced growth prospects
FLIR TG268 and TG298 Handheld Thermal Imagers Cut Diagnostic Time and Simplify Maintenance Reporting
Next-Generation Models Provide Inspectors, Technicians and Engineers with Faster Boot-Up, Higher Temperature Range, Enhanced Image Quality, and Remote Monitoring.
MoistTech to Highlight the IR3000 Series Moisture Sensor at WasteExpo 2025, Booth #1866
Enhance Efficiency, Reduce Costs, and Improve Overall Material Quality
Prima Power to Showcase Revolutionary Panel Bending with Smart Technology at EXPOMAFE 2025
Visit Booth E110 - 100m2 to witness the first panel bender available in Brazil
Newcastle Systems Unveils CheckMate 1000 Mobile POS Station
Compact, customizable, and powered to perform, the CheckMate 1000 helps retailers eliminate long lines, reclaim floor space, and maximize profits.
KROHNE to Showcase Precision Flow Measurement Solutions at Data Center World 2025
Discover industry-leading solutions for water, hydrogen, and natural gas applications at booth #1906
Petite Lumiere: Using Manufacturing Automation After China's Secret Exposure
With manufacturing secrets potentially compromised, what innovative strategies will define the next era for brands in the global market? We'll explore Petite Lumiere's approach.
LISSMAC Corporation to Showcase Advanced Metal Finishing Solutions at FABTECH Mexico 2025, Booth #1342
Cutting-Edge Deburring and Grinding Solutions to Enhance Manufacturing Efficiency
EXAIR's Chip Vac Vacuum Family
EXAIR's compressed air operated Chip Vac™ is an industrial duty vacuum designed specifically for vacuuming chips. It creates a powerful direct flow action that vacuums metal, wood or plastic chips into an ordinary drum. The Chip Vac is used to clean chips from fixtures, floors and work surfaces of machining centers, lathes, saws, mills and other industrial equipment.
Tezmaksan launches expanded warranty for CubeBOX automation systems
Extended coverage reinforces service and support for users worldwide
I.C.T Unveils PCB Assembly Solutions for Global Manufacturers
I.C.T, a leading provider of SMT and THT manufacturing solutions, announces its advanced range of PCB assembly machines, designed to boost efficiency and precision for electronics producers worldwide.
New MVTec HALCON version includes deep learning-based technology for robust bin picking
• Deep 3D Matching as a robust, flexible and fast feature for finding objects in three-dimensional space
• In addition: Numerous improvements and optimizations of already available technologies
• Release on May 27, 2025
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