MesoGlue: Room Temperature Metallic Glue
From Hanchen Huang of Northeastern University:
MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.
MesoGlue Silver:
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.
MesoGlue Eutectic:
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.
(MesoGlue Homepage)
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The Wire Association International (WAI), Inc.
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry. WAI hosts trade expositions, technical conferences, and educational programs.
