Ericsson and Comau partner to explore potential of 5G for smart manufacturing

Through the combination of Ericsson's leadership in 5G technologies and Comau's leadership in automated manufacturing solutions, this collaboration aims to prove the benefits of advanced Internet of Things (IoT) solutions for industrial automation.

Nebbiolo Technologies™ Launches its Fog Computing Offering to Address the Challenges of Industrial Automation

Nebbiolo TechnologiesTM launched on February 9th, 2017, its first product line, embracing fog computing (often referred to as edge computing) as a keystone for the Industrial IoT and Industry 4.0. In this context, fog computing will provide a powerful new functionality layer in the industrial automation pyramid, enabling the convergence between Information Technologies (IT) and Operational Technologies (OT).

Telit to Demonstrate Real-Time Industrial IoT Data Collection Solution at Mobile World Congress

Miniature machines will let participants experience real-world interaction between the physical world and digital world

GoEngineer Continues Global Leadership in 3D Design Software and 3D Printing

Earns Top Awards Worldwide from SOLIDWORKS and Stratasys

Type A Machines Partners with Silicon Valley's BriteLab to Manufacture its Industrial-Grade Series 1 3D Printer

OEM Level Manufacturing Relationship Enables Type A Machines to Meet Global Growth Demands While Maintaining "Made in Silicon Valley" Advantage.

Rising Media's 5th Annual Inside 3D Printing Conference & Expo Returns to the Javits Center in NYC, March 14 & 15

Rising Media, Inc. announced that Inside 3D Printing Conference & Expo will return to New York City on March 14-15, 2017 at the Javits Convention Center. Thousands of additive manufacturing professionals are expected to attend the 5th annual event for two days of education, exhibitions, special events, and networking opportunities.

Sensera Systems Captures the Future of the Jobsite at CONEXPO 2017

Sensera Systems' cameras are installed at the Tech Experience exhibit at CONEXPO-CON/AGG. Get a sneak peak of what's to come!

Low-cost Tin-Can Stepper Motors from Nippon Pulse feature high torque and compact size

Because of its high torque output and low profile construction, applications for tin-can stepper motors include, but are not limited to, printing, packaging, and medical devices.

Organizations Shaping the Made in America Movement

Three organizations Shop Floor Automations thinks you should hear about.

Embedded World News - Hardware vs. Software security - What Works Best for IoT Devices?

Icon Labs President Alan Grau selected to present at Embedded World Show Europe

Daifuku North America brings virtual reality to ProMat 2017

ProMat is the largest supply chain event in North America with over 37,000 pre-registered attendees and over 800 exhibiting companies.

Dell Accelerates IoT Adoption with New Edge Gateway for Small Spaces

Robust design allows customers to activate secure analytics at the edge of the network Incorporates industrial-grade capabilities at a maker community-friendly price with leading global support, service and reliability

PoLTE and ACS Partner to Deliver LTE-Based Precise Location Data to Commercial and Industrial IoT Markets

Next-Generation Location Technology Delivers More Precision and Security

The U.S. Naval Research Laboratory Adds 3D Metal Printing by Concept Laser to Enhance Research and Development Capabilities

This is NRL's first 3D metal printer that is laser powder-bed based and will strengthen their focus on additive manufacturing.

Dorner Showcases New 3200 Series with ARB™ Technology and AquaPruf VBT Conveyors at PACK EXPO East 2017, Feb. 27 - March 1 in

One of Dorner's newest conveyors, the 3200 Series conveyor with Intralox Activated Roller Belt™ (ARB) Technology, is perfect for moving boxes and packages in merging, diverting and aligning applications.

Records 751 to 765 of 2947

First | Previous | Next | Last

Featured Product

Bitflow is the leader in CoaXPress

Bitflow is the leader in CoaXPress

With the introduction of its Cyton and Karbon CXP frame grabbers, BitFlow has established itself as the leader in CoaXPress (CXP), a simple, yet powerful, standard for moving high speed serial data from a camera to a frame grabber. With CXP, video is captured at speeds of up to 6.25 Gigabits/Second (Gb/S). Simultaneously, control commands and triggers can be sent to the camera 20 Mb/S (with a trigger accuracy of +/- 2 nanoseconds). Up to 13 W of power can also supplied to the camera. All this happens over a single piece of industry standard 75 Ohm coaxial cable. Multiple CXP links can be aggregated to support higher data rates (e.g. four links provide 25 Gb/S of data). BitFlow CXP frame grabbers open the door to applications where cable cost, routing requirements and long distances have prevented the move to high resolution, high speed digital cameras. In many cases, existing coaxial infrastructure can be repurposed for CXP with very low installation costs.