PACK Expo - Rennco's New NextGen Series of Vertical Bagging Machines Improves on Time and Reliability

Rennco created a more flexible and technically advanced platform upon which to build a whole new generation of vertical bagging machines. (Rennco Pack Expo Booth # S-3836)

Molex Showcases Encompass Program Solutions at Rockwell Automation Fair® 2016

Three Demos and Multiple Displays Focus on Advanced Automation

PACK Expo - Delta Presents Integrated Automation Solutions for Packaging Machinery at PACK EXPO International 2016

Company launches new controller programming software ISPSoft version 3.0, combining logic and motion into one integrated solution

Dassault Systèmes Supports Industrial Strategies in France and China with its 3DEXPERIENCE Platform

Co-Leader of France's "Industry of the Future" Now Collaborating on the "Made in China 2025" Initiative to Accelerate High Performing and Innovative Production Systems

Mitsubishi Electric Automation Announces Emergency After Hours Parts Shipping

Mitsubishi Electric Automation, Inc. announces today that it will now offer after hours emergency parts shipping for CNC parts to minimize the impact unexpected breakdowns can have on manufacturers.

Turck expands breadth of ultrasonic sensor products with six line extensions

To help engineers improve sensor operations in unique applications, Turck introduces six line extensions to its ultrasonic sensor offerings. These new products expand the breadth of Turck's solutions to build a more comprehensive ultrasonic sensor portfolio for its customers.

IoT Tech Expo: The leading Internet of Things conference announces keynote speakers for upcoming global event in London 2017

The world leading IoT conference will arrive in London on January 23-24th, with keynote speakers from the likes of Shell, Rolls-Royce, SSE, Maersk, Thyssenkrupp, Sky, Nest, Ford, Heathrow Airport and more. The 2-day event will cover a range of industries from manufacturing to healthcare, transportation to government, logistics to retail, with a total of 7 conference tracks covering the entire Internet of Things ecosystem.

Microsemi Unveils New Ethernet PHYs for Industrial and IoT Applications

New Single Port Gigabit and Fast Ethernet PHYs Solve Rapidly Growing Ethernet Connectivity Needs of Diverse Networking Systems

BitFlow Shatters CoaXPress Price Barrier with Low Cost Aon-CXP Frame Grabber

Single link CoaXPress frame grabber is ideal match for today's smaller, cool running and affordable CXP cameras

Icon Labs Launches Embedded Credentialing Solution for IoT Devices, Machines, and Endpoints

OEMs Can Now Easily Provide Automated Security Credentialing and Certificate Enrollment for their Embedded Linux and RTOS-based IoT and IIoT Devices Floodgate Key Manager Provides Integration with Verizon IoT Secure Credentialing Service, Allowing Automated Certificate Enrollment for IoT Endpoints

Cemtrex Enters into Agreement to Acquire Electronics Manufacturer, Establishing Presence in Silicon Valley

The Target Company has averaged $7 million in annual revenues over the last two years. The company also has an office in India to support the engineering & prototype development and operational activities.

Danforth Plant Science Center Develops Versatile Field Phenotyping to Benefit Farmers

Solar-powered PheNode Is Set for Investment Stage

PACK Expo -Radley Software Platform at PACK EXPO 2016

Radley Corporation announces participation at international packaging trade show in Chicago, IL

Taiwan Machine Tool Show - Committed to Industry - Activating Intelligent Manufacturing.Heading towards Industry 4.0

Organized by Taiwan Machine Tool & Accessory Builders' Association, TMTS 2016 will be held on November 23rd-27th at Greater Taichung International Expo Center (GTIEC), located near THSR Taichung Station. The exhibition area will be 78,000 square meters with 700 exhibitors and 4,000 booths.

PACK Expo - Pro Mach Features at Pack Expo a One-Stop-Shop for End of Line Packaging Solutions

The End of Line Packaging Group fields 11 brands in six exhibits and showcases the latest easy to use, fast changeover systems. (Pro Mach Contiguous Booths in the South Hall #'s 3738, 3742, 3748, 3832, 3836, and 3842.)

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Automation & Networking - Featured Product

US Digital - E4T Miniature Optical Kit Encoder

US Digital - E4T Miniature Optical Kit Encoder

US Digital is pleased to announce the launch of the E4T, their latest series of miniature high performance optical encoders. The E4T series delivers a marked performance increase over similar encoder models and designed to be an enhanced replacement for the E4P encoder series. The E4T utilizes state of the art transmissive optical sensing technology, and incorporates US Digital's own proprietary OptoASIC. Assembly of the E4T is simple and efficient and retains the previous E4P's form factor. Key features of the new E4T include: • Mechanically and Electrically Interchangeable with E4P • Improved Quadrature Signal Strength • 100 kHz Frequency Response • Transmissive Optical Design • Collet Style Push on Optical Disk Design (Patent Pending) • Simple & Efficient Assembly Process As with all of our products the E4T is designed and manufactured in their Vancouver, Washington USA facility and is available for purchase as of December 2014.