Electronic Assembly Technology Improves Packaging
On September 25, 2017, at 1pm PST, SMAC Moving Coil Actuators President, Edward Neff, and SMAC Moving Coil Actuators Sales Manager, Steve Curtiss, will return to Pack Expo Las Vegas to speak at the session, Applying "Zero Defect" Electronic Assembly Actuators to the Packaging Industry. During this session, Mr. Neff and Mr. Curtiss will explain how mechatronic advancements in Electronic Assembly can be applied to the Packaging Industry to maximize quality, uptime, and profits.
Peco InspX Announces Presence At 2017 Pack Expo In Las Vegas, Nevada
Peco InspX Will Feature a Special Exhibit on Plastic Detection with X-Ray Systems
Matrix Introduces at Pack Expo Two New Morpheus Models for High-Throughput F/F/S Applications
For frozen, fresh-cut, and IQF packaging, a single new Morpheus XL featuring extra wide jaws can do the work of two older and less capable f/f/s machines. For companies standardized on Rockwell Automation, Matrix developed a new Morpheus offering state-of-the-art Rockwell Automation controls, drives, I/O, and industrial computer. (Matrix Pack Expo Booth # C-3425)
Dow to Showcase How Material Advances Can Improve Battery Design and Assembly at The Battery Show
Enclosed Power Supplies for Automation from Balluff
The hardware for the enclosed power supplies is designed for inclusion in a self-contained piece of automation equipment.
Butler Automatic Announces Expanded Sales Team to Service the Packaging Industry
Team includes industry veterans focused on global sales and application support
Retrofitting industrial machines with IoT board to measure their performance
This new modular solution, conceived and developed by the Italian digital innovation and design shop Cefriel, is designed to work both with older, non-natively connected machinery, and with newer models that are equipped with Internet connections.
Mouser Electronics and Grant Imahara Explore How Augmented Reality Can Help Build Smarter Cities in New Video Series
In the newest video, Imahara travels to Los Angeles to meet with innovators and engineers from DAQRI and to learn about the new possibilities that augmented reality can bring to modern construction and manufacturing. In DAQRIs virtual reality (VR) augmented reality (AR) Lab
HEIDENHAIN Touch Probes Selected For Use in Expanded FANUC America Training Centers
HEIDENHAINs touch probes will be used for hands-on exercises in the FANUC machining labs.
EIT Digital to retrofit industrial machines with smart 'IoT board' measuring performance
Smart, connected machines are increasingly being used in factories, as they allow manufacturers to monitor in real time performance and production. However, for many companies (especially small and medium-sized enterprises) replacing their old equipment altogether with newer, smarter models is often not an option, due to the high cost of investment. But what if, instead of replacing, they could just retrofit them, adding new capabilities, such as Internet access, by means of connection with an external IoT board? That's exactly what the new EIT Digital activity 'I4.0 Production Monitoring Solution', conceived and developed by Italian 'digital innovation and design shop' Cefriel is proposing.
Molex Debuts Polymicro FR Optical Fibers
UL 94 V-0 low flammability rated optical fiber for industrial and telecommunications networks
Brenton Engineering Showcases Innovative Collaborative Robotics Solution at Pack Expo
Brenton displays an application customized for the food industry integrating the vision-guided FANUC CR-7iA/L. (Brenton Engineering Pack Expo Booth # C-3025)
Building The STEM Pipeline of Talent
In the US, just 16% of college students graduate with a STEM degree (Science, Technology, Engineering, or Mathematics) each year, a statistic strikingly lower than other developed countries. This shortage impacts employers in these fields, who often struggle to recruit highly-skilled candidates, despite offering compelling compensation packages.
Microsoft Boosts Investment in Industrial IoT with Asian Partner Alliance at IoT Expo 2017
One year after the launch of the IoT Innovation Center in Taiwan, Microsoft has boosted investment in the Industrial IoT with the availability of an OPC UA testing lab and extended support to customers and partners in Asia through its Federated Lab initiative to accelerate digital transformation and tap into the global market.
ITW Dynatec® to Feature New Simplicity™ Adhesive Supply Unit at Pack Expo 2017
ITW Dynatec®, a global leader in hot melt adhesive application systems, will feature its latest SIMPLICITYTM Adhesive Supply Unit (ASU) at Pack Expo 2017, Las Vegas Convention Center, September 25-27, Central Hall booth 4012.
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