In SMT and DIP setups, wave solder in-process AOI such as I.C.T AI-5146W identifies soldering flaws, component faults, and alignment issues right after welding. AI-powered dual-side imaging integrates without stopping flow, raising yield and cutting waste. Explore defects, methods, and practical gains for engineers and procurement.

As a customer's procurement manager, I always balance equipment costs with ongoing savings in PCB assembly. Wave soldering defects—poor fill, balls, shorts—once bloated scrap and delayed us. Adopting I.C.T's AI-5146W wave solder in-process AOI turned it around, providing steady PCB handling from the start.

Our plant hit bottlenecks in mixed runs. Wave solder left pin holes or lifted pads on auto PCBs, demanding heavy rework. Manual inspections crawled at 60 boards/hour, 18% defects escaping. The AI-5146W, post-wave placement, dual-scans: 12MP camera, 21.5μm res, 0.23s/FOV. Accommodates up to 520x380mm PCBs, 0.3-6mm thick, 75mm heights both sides.
Setup was simple—one-click program, adjustable conveyor, remote control for multiples. Detection uses color contrast for missing/contaminated spots; outline for flipped/broken; template for fine solder diffs; OCR for labels. RGBW lights clarify wetting or tombstoning.
One batch of LED panels had alignment opens. AOI instant flags sent marked boards to fix. Engineer adjusted fixtures per reports, misalignment down 35%. Outcomes: first-pass 84% to 97% in two months, downtime -28%, scrap costs notably lower.
Floor feedback positive. Operator: "Alerts with coords—no guesswork." Procurement values ROI: less inspection labor, material savings. I.C.T global support—training, remote diagnostics—fosters reliability.
Meets IPC A-610, CE/ISO9001/etc certified. For procurement, offsets initial outlay with efficiency. Engineers get low falses, data for tweaks like flux to curb residues.
In sum, Wave Solder In-Process AOI streamlines assembly, addressing defects upfront. Supports volume SMT reliably.