PACK EXPO Q&A with Mitsubishi Gas Chemical America

To meet consumer demands for authentic and fresh-tasting foods, some innovative packaging technologies are doing the job normally given to preservatives, enabling manufacturers to keep the ingredient list to a minimum.

Talking PACK EXPO with Emulate3D

Visitors to our booth S-7527 will be able to try out the HTC Vive Virtual Reality (VR) headset to visualize typical end of line automated solutions. Any Emulate3D, Sim3D, or Demo3D model can be easily viewed in VR, which provides a genuinely immersive experience which puts you in the facility with the running equipment or system.

Talking PACK EXPO with Shane Novacek, Marketing Communications Manager at Beckhoff Automation

Visitors to the Beckhoff booth will again be able to "BYOD", using their own smartphones and tablets to connect with PC-based control demos - including a wall of IoT-enabled devices, plus articulated robot arms from Stäubli - using any mobile device with a web browser.

Special Tradeshow Coverage for PACK EXPO Las Vegas

PACK EXPO will be held from September 25th - 27th in Las Vegas. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.

Special Tradeshow Coverage for PACK Expo International

PACK Expo will be held from November 6th - 9th in Chicago, Illinois. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.

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Featured Product

Novotechnik - Vert-X 05E Series of dual angle/speed sensors

Novotechnik - Vert-X 05E Series of dual angle/speed sensors

Vert-X 05E Series of dual angle/speed sensors. The series features easy mounting in small and narrow spaces with a 5 mm body depth and mounting flanges with metal inserts. The sensors make measurements only 6 mm from edge of product for close-to-wall measurement applications. Vert-X 05E Series sensors measure angles from 0 to 360°, rotational speed and direction with repeatability to 0.1°.