Matsuura USA Rolls Out Matsuura Lumex 3D Printer Series in US Market at Additive Manufacturing Americas 2017

Their first debut in the US market will be at Additive Manufacturing Americas 2017 being held on December 6-8, in Pasadena, California. The three day B2B conference and exhibition focuses on the fastest growing verticals of industrial AM / 3D printing technologies: healthcare, aerospace and automotive.

Matsuura Machinery USA, Inc announces exhibition plans for the Matsuura LUMEX 3D Printer Hybrid Series. Their first debut in the US market will be at Additive Manufacturing Americas 2017 being held on December 6-8, in Pasadena, California. The three day B2B conference and exhibition focuses on the fastest growing verticals of industrial AM / 3D printing technologies: healthcare, aerospace and automotive.


The Matsuura LUMEX Avance Series, comprising the Matsuura LUMEX Avance-25 and Matsuura LUMEX Avance-60 machines, combines selective laser sintering (SLS) and high-speed milling (HSM) and is intended for the manufacture of highly complex, integrated dies, molds and parts in shapes and configurations previously not attainable using traditional milling methods.

The Matsuura LUMEX Avance-25 is predominantly used in the high-value die and mold market. It is able to process parts up to 256 x 256 x 185 mm as standard, although there is an option that allows for processing parts up to 256 x 256 x 300. Dies and molds featuring complex geometries can be fabricated as single pieces, said to shorten lead times and reduce costs to half or one-third those of conventional manufacturing methods.

Parts produced on the Matsuura LUMEX Avance-25 are highly accurate as metal powders are melted and sintered using a laser and surfaces are precisely milled. 3D cooling channels can be incorporated into molds in the single setup, increasing cooling efficiency as well as enabling high-cycle injection molding for the realization of improved quality and precision at reduced cost.

The Matsuura LUMEX Avance-25 is capable of producing quick turn custom parts, be they prototypes or small-run production parts.

Matsuura Machinery USA launched the Matsuura LUMEX Avance-60 in response to increasing demand from the aerospace and automotive industries for a larger machine. It has a maximum work size and is able to process parts up to 600 x 600 x 500 mm and incorporates a 1 kW laser for shorter sintering times.

The Matsuura LUMEX Avance-60 features a fully integrated, automatic powder supply, collection and recycling system. Metal powders are distributed in the sintering chamber without the need for operator contact, eliminating powder dispersion and ensuring a safer working environment. Unused powder is collected, sieved and recycled.

‘Often referred to as a one-machine, one-process cutting solution, the Matsuura LUMEX Avance Series permits production of the most complex and challenging parts through total manufacturing by digital engineering using 3D data,' said Tom Houle, director, Matsuura LUMEX, North America, Matsuura Machinery USA. ‘Engineers are limitless in their imagination and are revolutionizing conventional manufacturing.'

The Matsuura LUMEX Avance Series has been manufactured for over 10 years and has recently been made available in North America from Matsuura Machinery USA. Furthermore, the company is completing a Matsuura LUMEX laboratory and demonstration facility at its corporate headquarters in Saint Paul, Minnesota, adding to three other Matsuura LUMEX centers of excellence in Germany, Japan and the UK.


For more information on Matsuura products, contact: Marketing@MatsuuraUSA.com or visit: matsuurausa.com.

Featured Product

Bitflow is the leader in CoaXPress

Bitflow is the leader in CoaXPress

With the introduction of its Cyton and Karbon CXP frame grabbers, BitFlow has established itself as the leader in CoaXPress (CXP), a simple, yet powerful, standard for moving high speed serial data from a camera to a frame grabber. With CXP, video is captured at speeds of up to 6.25 Gigabits/Second (Gb/S). Simultaneously, control commands and triggers can be sent to the camera 20 Mb/S (with a trigger accuracy of +/- 2 nanoseconds). Up to 13 W of power can also supplied to the camera. All this happens over a single piece of industry standard 75 Ohm coaxial cable. Multiple CXP links can be aggregated to support higher data rates (e.g. four links provide 25 Gb/S of data). BitFlow CXP frame grabbers open the door to applications where cable cost, routing requirements and long distances have prevented the move to high resolution, high speed digital cameras. In many cases, existing coaxial infrastructure can be repurposed for CXP with very low installation costs.